View BD6074GUT-E2_8107701.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/18 datashee t tsz22111 ? 14 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0g3g0c200360-1-2 12.sep.2012 rev.001 www.rohm.com white led driver with synchronous boost converter and pwm brightness control for up to 4 leds in series bd6076gut general description the bd6076gut is a white led driver ic with synchronous rectification t hat can drive up to 4leds. with synchronous rectification (no external schottky diode required) and small package, they can save mount space. and the brightness of led can be adjusted by using pwm pulse on en pin. features synchronous rectification boost dc/dc converter no external schottky diode required driving 4 series white leds internal load disconnect sw over voltage protection protect open and short output thermal shut down brightness adjustment by external pwm pulse small and thin csp package in 8pins key specifications power supply voltage range: 2.7v to 5.5v switching frequency: 1.25mhz(typ.) quiescent current: 0.1a(typ.) operating temperature range: -30c to +85c package w(typ.) x d(typ.) x h(max.) vcsp60n1 1.68mm x 1.68mm x 0.68mm applications white led backlight torch light and easy flash for camera of mobile phone typical application circuit pin configuration sw vout vin en gnd vfb gnda voutput cin l 10h or 22h cout rfb white led bd6076gut c1 b1 a1 a2 a3 b3 c3 c2
2/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 absolute maximum ratings (ta=25 c) parameter symbol ratings unit condition maximum applied voltage 1 vmax1 7 * 1 v vin, en, vfb, test pin maximum applied voltage 2 vmax2 20 * 1 v sw, vout, voutput pin power dissipation pd 800 * 2 mw operating temperature r ange topr -30 to +85 c storage temperature range tstg -55 to +150 c *1 these values are based on gnd and gnda pins. *2 50mm58mm1.75mm at glass epoxy board mount ing. when it?s used by more than ta=25 c, it?s reduced by 6.4mw/ c. recommended operating ratings (ta=-30 c to +85 c) parameter symbol ratings unit condition min. typ. max. power supply voltage vin 2.7 3.6 5.5 v electrical characteristics unless otherwise specified ta =-30 c to +85 c, vin=3.1 to 5.5v parameter symbol limits unit condition min. typ. max. [ en terminal ] en threshold voltage (low) vthl - - 0.4 v en threshold voltage (high) vthh 1.2 - - v en terminal input current iin - 18.3 30.0 a en=5.5v en terminal output current iout -2.0 0.0 - a en=0v [ switching regulator ] quiescent current iq - 0.1 2.0 a en=0v current consumption idd - 1.0 1.5 ma en=2.6v,vfb=1.0v,vin=3.6v feedback voltage vfb 0.47 0.50 0.53 v inductor current limit icoil 310 400 490 ma vin=3.6v *1 sw saturation voltage vsat - 0.14 0.28 v isw=200ma vout pmos resistance ronp - 2.1 3.2 ? ipch=200ma, vout=13v voutput pmos resistance rpsw - 1.8 2.0 ? ipsw=20ma, vout=13v switching frequency fsw 1.0 1.25 1.5 mhz duty cycle limit duty 83.0 91.0 99.0 % vfb=0v output voltage range vo - - 18.0 v over voltage limit ovl 18.0 18.5 19.0 v vfb=0v uvlo detect voltage uvlod 1.75 - 2.25 v falling vin level *1 this parameter is tested with dc measurement.
3/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 pin description pin name in/out ball number function gnda - a1 analog gnd en in a2 enable control (pull down by inner resistor) voutput out a3 switching output vin in b1 power supply input vfb in b3 feedback voltage input vout out c1 vout, connected to output capacitor sw in c2 switching terminal gnd - c3 power gnd block diagram tsd - + sw over vo l tage protect - + short protect vout vin + + - osc control c urrent sence q + - s q r en gnd pwmcomp erramp vfb gnda th erma l shutdown voutput uvlo - + short protect
4/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 typical performance curves figure 1. current consumption vs. power supply voltage iin [ma] figure 2. quiescent current vs. power supply voltage iin [a] figure 3. oscillation frequency vs. power supply voltage frequency [mhz] figure 4. feedback voltage vs. power supply voltage vfb [mv]
5/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 typical performance curves - continued figure 5. inductor current limit vs. power supply voltage 300 350 400 450 500 3.13.53.94.34.75.15.5 vin [v] inductor current [ma] ta = 2 5 ta = - 3 0 ta = 8 5 figure 6. efficiency vs. led current (4led=vout13v) efficiency [%] figure 8. output power vs. power supply voltage coil : tdk vls3010t220m output power [mw] figure 7. efficiency vs. led current (4led=vout13v) coil : tdk vls3010t220m efficiency [%]
6/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 figure 12. soft start (cout=4.7f, iled=15ma) typical performance curves - continued figure 10. led open output voltage 2.iin =1.66v 5.3ms idd=1.5m a 1.vout 1v/div ac 2.iin 200ma/div dc (4ms/div) 1.vout vin=3.6v ta =25 figure 11. led brightness adjustment (cout=4.7f, iled=15ma) peak=155ma 1.en 4.icoil 3.vfb 2.vout vout drop = 76mvpp 1.en 2 v/d iv dc 2.vout 1 00mv/div ac 3.vfb 0.5v/div dc 4.iin 200ma/div dc (3ms/div) figure 9. efficiency vs. power supply voltage coil ; tdk vls3010t220m efficiency [%]
7/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 typical performance curves - continued figure 14. led brightness adjustment for pwm control (expansion) figure 13. led brightness adjustment for pwm control figure 15. vin line transient (cout=4.7f, iled=15ma) vin: 3.1v ? 2.8v 1.vin 2.vout 3. vfb 3.1v 2.8v 600s 10s 10s vout=100mvpp vfb=30mvpp 1.vin 200mv/div dc 2.vout 100mv/div ac 3.vfb 50mv/div ac
8/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 test circuit *test circuit a (for inductor current limit, feedback voltage.) procedure ~inductor current limit~ 1. start to increase iout from 0ma gradually. 2. you will find that vout will start to go down and the duty will be decreased. 3. then, you can measure the coil current as ?inductor current limit? ~vfb voltage~ 1. supply 0ma to iout 2. then, you can measure the vfb voltage as ?feedback voltage?. figure 16. test circuit a *test circuit b (for over voltage limit,duty cycle limit, switching frequency) procedure ~over voltage limit~ 1. start to increase vout from 9v to 20v 2. you will find frequency change from around 1mhz to 0hz 3. then, it is ?over voltage limit? ~duty cycle limit, switching frequency ~ 1. supply 9v to vout terminal 2. then, you can measure the duty as ?duty cycle limit? and the frequency and ?switching frequency?. figure 17. test circuit b *test circuit c (for quiescent current, current comsumption, en terminal input/output current, en threshold voltage(low/high)) figure 18. test circuit c icoil vin sw vout en gnda gnd vfb 10h or 22h 1f 24 ? v in rfb a iou t tall ton duty= tall ton monitor v 1f 3.1~5.5v voutput vin sw vout en gnda gnd vfb 1f vin 3.1~5.5v 9v to 20v ta ll ton duty= tall ton monitor 1f voutput vin sw vout en gnda voutput gnd ien 3.1~5.5v a a icc vfb 1uf 0.0~5.5v 1.0v(current comsumption)
9/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 operation bd6076gut is pwm current mode dc/dc conv erter with fixed frequency. it adopts sy nchronous rectificat ion architecture. the feature of the pwm current mode is that input is the combination of erro r components from the error amplifier, and a current sense signal that contro ls the inductor current into slope waveform for sub harmonic oscillation prevention. this output controls q1 and q2 via the rs la tch (refer to page 3). timing of q1 and q2 is precisely adjusted so that they will not turn on at the same time, thus putting them into n on-overlapped relation. in the period when q1 is on, energy is accumulated in the external inductor, and in the period when q1 is off, energy is transferred to the capacitor of vout via q2. further more, bd6076gut has many safety functions, and their detection signals stop switching operation at once. functional descriptions 1) soft start and off status bd6076 has soft start function and off status function. the soft start function and the off status function prev ent large current from flowing to the ic via coil. occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at turning off is prevented by the off status function. as for detailed actions, refer to the block diagram (figure 19) and the timing chart (figure 20). ? soft start when vout is smaller than vshort, to decrease charge current pmos is set to off by pmos startup control (in term ?i?). vshort means ?vout short detect voltage?. after vo ut is bigger than vshort, pmos is turned on and start switching. in term ?ii? (vshort < vout < vin), status of cu rrent limiter is ?soft mode?. so ?a? voltage is restricted and ?d? duty is kept low. therefore vout voltage goes up slowly and coil current is restrict ed. in term iii (vout > vin), status of current limiter is ?normal mode?. so ?a? voltage goes up suitable voltage, and ?d? duty goes up slowly. and then vout voltage goes up to required voltage. operation max current current at start 450ma current at pwm 300ma figure 19. block diagram of soft start and off status soft mode d d c c u u r r r r e e n n t t l l i i m m i i t t normal mode v v o o u u t t vshor t vi n i i i i i i i i i i i i e e n n figure 20. timing chart ? off status the gate voltage of the switching tr eit her "h" or "l" at power off depends on t he operation conditi ons at that time. when it is fixed to "h", the switching tr remains to be on, and invalid current from the battery is consumed. in order to prevent this, at power off, d is always fixed to l level. so that, it is possible to prevent invalid current at power off. a d r s q q sw l c led current pwm comp osc rfb b vfb vout charge current off status erramp soft reference soft current limit pmos startup control
10/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 2) isolation control bd6076gut has isolation control to pr event led wrong lighting at power off. the cause of the led wrong lighting is leak current from vin to the white led. therefore, when bd6076gut powered of f (en = l), the isolation control cuts the dc path between sw and vout, so that, it prevents from leak current from vin to led. vin sw vout vfb white led voutput figure 21. isolation control 3) short-circuit protection and over voltage protection bd6076 has short-circuit protection and over voltage protecti on. these detect the volta ge of vout, voutput, and at error, they stop the output tr. details are as shown below. ? short-circuit protection in the case of short-circuit of the dc/dc output (vout) and switched output (v output) to gnd, the coil or the ic may be destructed. therefore, at such an error as vout, votput becoming 0.7v or below, the under detector shown in the figure works, and turns off the output tr, and prevents the coil and the ic from being destructed. and the ic changes from its action condition into its non acti on condition, and current does not flow to the coil (0ma). ? over voltage protection in a case of error as the ic and the led being cut off, over voltage causes the sw terminal and the vout terminal exceed the absolute maximum ratings, and may destroy the ic. therefore, when vout becomes 18.5v or higher, the over voltage limits works, and turns off the output tr , and prevents the sw terminal and the vout terminal from exceeding the absolute maximum ratings. at this moment, turns into non operation condition from op eration condition, and the output voltage goes down slowly. and, when the output voltage becom es the hysteresis of the over voltage limit or below, the output voltage goes on up to 18.5v once again. this protection action is shown in figure 22. figure 22. block diagram of short-circuit protection and over voltage 4) thermal shut down bd6076gut has thermal shut down function. the thermal shut down works at 175 ? c or higher, and while holding the setting of en control from the outside, turns into non operation condition from operat ion condition. and at 175 ? c or below, the ic gets back to its normal operation. vout over detector control under detector over voltage ref under voltage ref driver sw cout under detector under voltage ref voutput
11/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 start control and brightness control bd6076gut can control the start conditions by its en terminal , and power off at 0.4v or below, and power on at 1.2v or higher. and by changing the duty of power on and of f by pwm control, the led brightness can be adjusted. 1. pwm brightness adjustment is done by giving pwm signal to en as shown in figure 23. the bd6076gut is powered on/off by the pwm signal. by this method, led current is controlled from 0 to the maximum current. the average led current increases with proportion to the duty cycle of pwm signal. while in pwm off-cycle mode, the ic and led both consume no currents, thus providing a high-efficiency operation. the recommended pwm frequency is 100hz to 300hz. figure 23. the brightness adjustment example of en terminal by pwm (fpwm = 100 to 300hz) figure 24. the rule of pwm signal of en vfb characteristic on pwm function bd6076gut constantly controls the rising time to dec rease the tolerance of the vfb voltage at pwm function. period high pulse period low pulse en en minimum high pulse = 13s (duty = 1/256) range of period = 3.3 ~ 10 ms minimum low pulse = 13s (duty = 255/256) range of period = 3.3 ~ 10 ms en vfb 13 s typ figure 25. vfb signal at pwm figure 26. vfb voltage line regulation (pwm duty=30%) typ vfb [mv] 3.1 3.6 5.5 +3% -3% typical target spec vin [v] max min 150mv(average) vfb [mv] 500mv 150mv (average) duty 30% time vin sw vout en gnda gnd vfb 10h or 22h 4.7f 33ohm vin pwm 4.7f voutput
12/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 vin characteristic in battery charge transient during battery charger is normally +300mv, 250hz(duty 85%) from a baseline battery voltage 3.1 to 2.8v. in this term, it is necessary that vout voltage noise is less than 200mvp-p. setting range of led current led current is determined by the voltage of vfb and the resistor connected to vfb terminal. iled is given as shown below. iled = vfb/rfb the current in the standard application is as shown below. vfb=0.5v, rfb=33 ? iled=15.2ma figure 28. standard application the shaded portion in the figure below is the setting range of led current to become the standard. depending on coils and white leds to be used, however, some ics may not be used at desired currents. consequently, for the proper setting of led current, thoroughly check it for the suitability under use conditions including applicable power supply voltage and temperature. figure 29. setting range of led current 0 10 20 30 40 50 60 70 80 7 8 9 10 11 12 13 14 15 16 17 18 vout[v] iled[ma] vin sw vout en gnda gnd vfb 10h or 22h 4.7f 33ohm vin pwm 4.7f voutput iled min 16a figure 27. battery voltage transient during charger vin [v] 3.1v 300mvp-p 10 s time 2.8v vout [v] time less than 200mvp-p 4ms 600s 3.1v 2.8v time vin [v] 10 s
13/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 selection of external parts recommended external parts are listed as below. when to use other parts than these, sele ct the following equivalent components. ? coil value tolerance manufacturer product number size dcr ( ? ) vertical size horizontal size height 22h 20% murata lqh3np n220mgol 3.0 3.0 0.9 1.10 10h 20% murata lqh3np n100mgol 3.0 3.0 0.9 0.57 22h 20% tdk vlf3010st 220m 2.8 3.0 1.0 0.90 10h 20% tdk vlf3010st 100m 2.8 3.0 1.0 0.49 22h 20% toko db3015c220m 2.6 2.8 1.5 0.60 10h 20% toko db3015c100m 2.6 2.8 1.5 0.29 22h 20% taiyo yuden nr3010t220m 3.0 3.0 1.0 1.24 10h 20% taiyo yuden nr3010t100m 3.0 3.0 1.0 0.54 22h 20% panasonic ellveg 220nn 3.0 3.0 0.9 1.44 10h 20% panasonic ellveg 100nn 3.0 3.0 0.9 0.48 please refer to the reference data of p.5 for the change in the efficiency when the coil is changed. ? capacitor value manufacturer product number size temperature range vertical size horizontal size height cin 1f murata grm188b11a105k 1.6 0.8 0.8 -25 c to +85 c 4.7f murata grm21bb31a475k 2.0 1.25 1.25 -25 c to +85 c cout 1f murata grm188b31e105k 1.6 0.8 0.8 -25 c to +85 c 4.7f murata grm21bb31e475k 2.0 1.25 1.25 -25 c to +85 c ? resistor value tolerance manufacturer product number size vertical size horizontal size height rfb 24 ? 1% rohm mcr006yzpf 0.6 0.3 0.23 value 15 ? 15r0 24 ? 24r0 33 ? 33r0 the coil is the component that is most in fluential to efficiency. select the coil wh ich direct current resistor (dcr) and curre nt - inductance characteristic are excellent. select a capacito r of ceramic type with excellent frequency and temperature characteristics. further, select capacitor to be used for ci n/cout with small direct current resistance, and pay much attention to the pcb layout shown in the next page.
14/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 pcb layout in order to make the most of the performance of this ic, pcb layout is very important. please note that characteristics such as efficiency and ripple will likely to change greatly depending on pcb layout. to battery gnd gnda en voutput vin vfb vout sw gnd cin cout rfb to battery power source l1 figure 30. pcb layout connect the input bypath capacitor cin between vin and gnda pin closely, as shown in the upper diagram. thereby, the input voltage ripple of the ic can be reduc ed. and, connect the output capacitor cout between vout and gnd pin closely. thereby, the output voltage ripple of t he ic can be reduced. connect the current setting rfb vfb pin closely. connect the gnd closely connection side of rfb direct ly to gnd pin. connect the gnda pin di rectly to gnd pin. when those pins are not connected directly near the chip, the performance of bd 6076gut shall be influenced and may limit the current drive performance. as for the wire to the inductor, make its resi stance component small to reduce electric power consumption and increase the entire efficiency. please keep away which are subj ect to be influenced like vfb pin in wire connection with sw. the layout pattern in consideration of these is shown in the next page. 112mvpp vout (vin=3.6v, ta=25 c, vout=14v. 20ma load) figure 31. output noise
15/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 recommended pcb layout figure 32. front surface (top view) figure 33. rear surface (top view) attention point for pcb layout for pcb layout design, the wire of power supply line shoul d be low impedance, and put bypass capacitor if necessary. especially the wiring impedance mu st be low around dc/dc converter. about heat loss for heat design, operate dc/dc conver ter in the following condition. (the following temperature is a guaranteed temperature, margin will be needed.) 1. periphery temperature ta must be less than 85 c. 2. the loss of ic must be less than dissipation pd. sw gnd gnda vin vfb en vout voutput gnd l1 cout cin rfb led led led led
16/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is a ssumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) operating conditions these conditions represent a range within which characteri stics can be provided approx imately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. 3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protec tive measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. 4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate t he power supply pattern for the digital blo ck from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consider ation to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacito r, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occu rrence of capacity dropout at a low temperature, thus determining the constant. 5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potentia l lower than the gnd voltage including an actual electric transient. 6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. 7) operation in str ong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. 8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from t he set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to tu rn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. 9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operati on, thus resulting in a malf unction and then breakdown of the input terminal. therefore, pay thorou gh attention not to handle the input te rminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so t hat any parasitic element wi ll operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. 10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. 11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the c onstant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. 12) thermal shutdown circuit (tsd) when junction temperatures become 175c (typ.) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolat ing the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefor e, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. 13) thermal design perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (pd) in actual states of use. 14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter.
17/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 ordering information b d 6 0 7 6 g u t - e 2 part number package gut : vcsp60n1 packaging and forming specification e2: embossed tape and reel marking diagram physical dimension tape and reel information status of this document the english version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. vcsp60n1 (top view) 6076 part number marking lot number 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp60n1 (bd6176gut) 1.68 0.05 1.68 0.05 1pin mark s 0.08 s 0.2min 0.6 0.075 a b 3 p=0.5 2 8- 0.3 0.05 2 c 1 ( 0.15)index post p=0.5 2 b 0.34 0.05 a 0.34 0.05 0.05 a b (bd6076gut)
18/18 datasheet d a t a s h e e t bd6076gut ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 12.sep.2012 rev.001 tsz02201-0g3g0c200360-1-2 revision history date revision changes 12.sep.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

▲Up To Search▲

Price & Availability of BD6074GUT-E2

	To Download BD6074GUT-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .